Cu₁Rh₂Sn₁ is an intermetallic semiconductor compound combining copper, rhodium, and tin in a defined stoichiometric ratio. This is a research-phase material belonging to the family of ternary intermetallics; such compounds are investigated for their potential in thermoelectric conversion, catalysis, and electronic device applications where the combination of metallic and semiconducting character offers distinctive properties. The material's industrial relevance remains largely experimental, with interest driven by potential applications in waste-heat recovery, catalytic converters, and high-temperature electronics where conventional semiconductors and single-element alloys fall short.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 179.4 | GPa | — | ||
Shear Modulus(G) | 69.82 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.07100 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3080 | eV/atom | — |