CoSn is an intermetallic compound combining cobalt and tin, forming a hard, dense metallic phase with moderate elastic stiffness. This material appears in electronic packaging, solder metallurgy, and thermal management applications where cobalt-tin phases contribute to joint strength, thermal conductivity, or wear resistance in demanding environments. CoSn is primarily of interest in advanced interconnect systems and specialized soldering contexts rather than structural applications, valued for its ability to form stable phases at elevated temperatures and resist thermal cycling degradation.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)3 entries | 126.5 | GPa | — | ||
| ↳ | 126.5 | GPa | — | ||
| ↳ | 127.3 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.1215 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν)2 entries | 0.2599 | - | — | ||
| ↳ | 0.2700 | - | — | ||
Shear Modulus(G)3 entries | 72.34 | GPa | — | ||
| ↳ | 72.34 | GPa | — | ||
| ↳ | 68.73 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.606 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -22.57 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.01240 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.08482 | eV/atom | — |