CoSn7 is an intermetallic compound in the cobalt-tin system, representing a defined stoichiometric phase rather than a conventional solid solution alloy. This material is primarily of research and industrial interest in electronics and joining applications, where it serves as a solder constituent or intermetallic barrier layer in microelectronic packaging and thermal management systems. CoSn7 offers potential advantages in high-temperature stability and wear resistance compared to conventional tin-based solders, though it is typically encountered as a secondary phase in composite solder systems rather than as a monolithic engineering material.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2035 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.2182 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.1939 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data