CoSn7

metal

· JVASP-122555· CoSn7

CoSn7 is an intermetallic compound in the cobalt-tin system, representing a defined stoichiometric phase rather than a conventional solid solution alloy. This material is primarily of research and industrial interest in electronics and joining applications, where it serves as a solder constituent or intermetallic barrier layer in microelectronic packaging and thermal management systems. CoSn7 offers potential advantages in high-temperature stability and wear resistance compared to conventional tin-based solders, though it is typically encountered as a secondary phase in composite solder systems rather than as a monolithic engineering material.

electronic solder systemsmicroelectronic packagingintermetallic coatingsthermal interface materialslead-free joiningresearch/development compounds

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	0.2035	lb/in³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.2182	eV/atom	—
Formation Energy(ΔHf)	0.1939	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

CoSn7

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control