CdSnAu is a ternary metallic alloy combining cadmium, tin, and gold—a composition historically explored for specialized electronic and thermal applications where both thermal conductivity and specific electrical properties are required. This material belongs to the family of precious-metal-bearing alloys and is primarily encountered in research and legacy industrial contexts rather than mainstream engineering, particularly where the combination of gold's corrosion resistance with tin and cadmium's soldering or bonding characteristics offers advantages. Engineers would consider this alloy for applications requiring high reliability and environmental stability in confined or critical electronic assemblies, though modern alternatives (lead-free solders, gold plating on copper substrates) have largely superseded direct use of this composition.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3397 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.2200 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.02580 | eV/atom | — |