BPS4 is a ceramic compound belonging to the layered materials family, characterized by relatively low density and moderate mechanical stiffness that make it suitable for lightweight structural applications. While specific industrial deployment is limited in published literature, materials in this class are actively investigated for advanced applications requiring combined properties of low weight, thermal stability, and reasonable mechanical strength—particularly in aerospace, thermal management, and emerging electronic device contexts. The material's layered structure suggests potential for exfoliation-based applications or composite reinforcement, making it of interest to researchers developing next-generation ceramic composites and thin-film technologies.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 26.68 | GPa | — | ||
Exfoliation Energy(Eexf) | 82.40 | meV/atom | — | ||
Poisson's Ratio(ν) | 0.3200 | - | — | ||
Shear Modulus(G) | 16.01 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 2.162 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 1.932 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr)2 entries | 4.060 | - | — | ||
| ↳ | 9.508 | - | — | ||
Electronic Dielectric Tensor(ε∞) | Matrix (redacted) | - | — | ||
Total Dielectric Tensor(ε) | Matrix (redacted) | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij)2 entries | 0.01075 | C/m² | — | ||
| ↳ | 0.08964 | C/m² | — | ||
Piezoelectric Stress Tensor(eij) | Matrix (redacted) | C/m² | — | ||
Seebeck Coefficient(S) | -265.1 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.3117 | eV/atom | — |