BiPbAu is a ternary precious metal alloy composed of bismuth, lead, and gold. This material belongs to the family of low-melting-point metallic systems and is primarily of research or specialized industrial interest, valued for applications requiring the combined properties of its constituent elements—particularly where the thermal, electrical, or joining characteristics of gold-bearing alloys are beneficial. The addition of bismuth and lead to gold systems can reduce melting point, improve machinability, or tailor specific functional properties for niche applications in electronics, jewelry manufacturing, or experimental joining processes.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 8,081.5 | ksi | — | ||
Shear Modulus(G) | -558.4 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.4187 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.04924 | eV/atom | — |