BeSiAs₂ is a ternary ceramic compound combining beryllium, silicon, and arsenic elements. This material belongs to the family of advanced ceramics with mixed-valence cation structures and is primarily investigated in research contexts for its potential semiconductor and optoelectronic properties. While not widely established in mainstream industrial production, compounds in this chemical family are of interest for specialized applications requiring specific electronic or thermal characteristics in extreme environments.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.1448 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 1.193 | eV | DFT · OptB88vdW | ||
| ↳ | 1.747 | eV | DFT · TBmBJ | ||
Dielectric Constant (Relative Permittivity)(εr)2 entries | 11.97 | - | DFT · OptB88vdW | ||
| ↳ | 11.44 range 10.98–11.90median of 2 measurements | - | DFT · PBEsol | ||
High-Frequency Dielectric Constant (ε∞)(ε∞)2 entries | 11.03 | - | DFT · OptB88vdW | ||
| ↳ | 8.907 | - | DFT · TBmBJ | ||
Electron Effective Mass(m*e) | 0.4467 | me | DFT · OptB88vdW · 27°C | ||
Hole Effective Mass(m*h) | 0.5433 | me | DFT · OptB88vdW · 27°C | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Piezoelectric Modulus(eij) | 0.4538 | C/m² | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.00305 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.00284 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | -224.1 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 224.3 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Spectroscopic Limited Maximum Efficiency (SLME)(SLME) | 28.39 | % | DFT · TBmBJ |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.2350 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data