BeGaCu is an experimental beryllium-gallium-copper intermetallic compound that belongs to the family of lightweight, high-performance metallic materials being explored for advanced aerospace and electronic applications. This material combines the low density characteristic of beryllium with gallium and copper to create an alloy with potential for high stiffness-to-weight ratios and tailored thermal or electrical properties. BeGaCu remains primarily in research and development stages; engineers would consider it only for specialized applications where its unique property combinations justify the challenges of processing and handling beryllium-based systems.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 92.89 | GPa | — | ||
Poisson's Ratio(ν) | 0.4300 | - | — | ||
Shear Modulus(G) | 9.370 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 6.417 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.2385 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.1329 | eV/atom | — |