BeCuW is a copper-beryllium-tungsten composite or alloy that combines the thermal and electrical conductivity of copper with the hardness and high-temperature stability contributions of beryllium and tungsten. This material is primarily used in aerospace, defense, and high-performance electronics applications where thermal management and dimensional stability at elevated temperatures are critical, offering advantages over conventional copper alloys in extreme environments where conventional materials would fail or require excessive cooling.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 11.04 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.4050 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.1466 | eV/atom | — |