BeCuSi is a beryllium-copper-silicon ternary alloy that combines the high strength and thermal conductivity of beryllium-copper systems with silicon additions for enhanced hardness and wear resistance. This material is typically used in high-performance applications requiring excellent electrical and thermal conductivity paired with mechanical strength, such as precision connectors, springs, and tooling components in aerospace and electronics manufacturing. BeCuSi offers advantages over standard beryllium-copper alloys through improved hardness and fatigue performance, making it attractive for demanding applications where both conductivity and structural integrity are critical.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 99.99 | GPa | — | ||
Poisson's Ratio(ν) | 0.3900 | - | — | ||
Shear Modulus(G) | -9.910 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.762 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3106 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.2362 | eV/atom | — |