BeCuP is a beryllium-copper-based alloy that combines the lightweight and stiffness characteristics of beryllium with copper's electrical and thermal conductivity and workability. This material is primarily used in precision applications where a combination of high strength, dimensional stability, and electrical properties is required, making it particularly valuable in aerospace, defense, and electronics sectors where traditional copper alloys or aluminum alternatives cannot meet simultaneous mechanical and conductive demands.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 79.28 | GPa | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.3900 | - | DFT · OptB88vdW | ||
Shear Modulus(G) | 34.63 | GPa | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.807 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.3500 | eV | DFT · OptB88vdW | ||
| ↳ | 0.7320 | eV | DFT · TBmBJ | ||
High-Frequency Dielectric Constant (ε∞)(ε∞)2 entries | 14.17 | - | DFT · OptB88vdW | ||
| ↳ | 10.16 | - | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Spectroscopic Limited Maximum Efficiency (SLME)(SLME) | 25.01 | % | DFT · TBmBJ |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3880 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.2526 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data