BeCuP is a beryllium-copper-based alloy that combines the lightweight and stiffness characteristics of beryllium with copper's electrical and thermal conductivity and workability. This material is primarily used in precision applications where a combination of high strength, dimensional stability, and electrical properties is required, making it particularly valuable in aerospace, defense, and electronics sectors where traditional copper alloys or aluminum alternatives cannot meet simultaneous mechanical and conductive demands.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 79.28 | GPa | — | ||
Poisson's Ratio(ν) | 0.3900 | - | — | ||
Shear Modulus(G) | 34.63 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.807 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3880 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.2526 | eV/atom | — |