BeCuP2 is a beryllium-copper alloy system with phosphorus addition, belonging to the family of high-strength copper-based alloys engineered for applications requiring superior strength-to-weight ratios and thermal conductivity. This material is primarily used in aerospace, defense, and precision electronics applications where lightweight components with excellent electrical and thermal properties are critical, offering advantages over conventional copper alloys through improved hardness and fatigue resistance while maintaining good workability.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.1375 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.4365 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.2885 | eV/atom | — |