BeCu2P is a beryllium-copper-phosphorus intermetallic compound that combines the lightweight properties of beryllium with copper's electrical and thermal conductivity, modified by phosphide bonding. This material belongs to the family of advanced intermetallics and is primarily of research and specialized industrial interest, used in applications requiring extreme property combinations such as high stiffness-to-weight ratios, electrical performance, or thermal management in demanding environments. Its beryllium content makes it valuable for aerospace and defense applications where weight savings are critical, though manufacturing and handling require careful attention to beryllium toxicity protocols.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 18,567.7 | ksi | — | ||
Poisson's Ratio(ν) | 0.4300 | - | — | ||
Shear Modulus(G) | 3,630.3 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2165 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.2270 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.1254 | eV/atom | — |