Au4In3Sn3

metal
· Au4In3Sn3

Au₄In₃Sn₃ is a ternary intermetallic compound combining gold, indium, and tin—a research-phase material that falls within the gold-based alloy family. This composition is primarily of academic and experimental interest in materials science, studied for its potential in high-reliability electronic interconnections and specialized soldering applications where the combination of precious metal stability, low-temperature processing, and intermetallic strengthening mechanisms may offer advantages over conventional lead-free solders. The material represents an exploratory approach to developing lead-free, RoHS-compliant interconnect systems with improved thermal and mechanical stability for demanding electronic assemblies.

electronic interconnects (research phase)lead-free soldering systemshigh-reliability microelectronicsexperimental metallic bondingAu-In-Sn intermetallic phase studiesnext-generation solder alloys

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
Units:
siimperial
PropertyValueUnitConditionsSource
Formation Energy(ΔHf)
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eV/atom——
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.