Au4 Pb2

semiconductor

· Au4 Pb2

Au4Pb2 is an intermetallic compound combining gold and lead in a fixed stoichiometric ratio, belonging to the broader family of precious metal intermetallics. This material is primarily of research and specialized industrial interest rather than a commodity material, with applications in high-reliability electronic contacts, thermal management systems, and specialized soldering applications where the unique combination of gold's nobility and lead's thermal properties offers advantages. Its notable characteristics versus alternatives include enhanced thermal conductivity compared to pure gold and superior corrosion resistance compared to lead-based materials, making it valuable for applications requiring both electrical reliability and thermal performance in demanding environments.

electronic connectors and contactsthermal interface materialsspecialized solder alloyshigh-reliability electronicsresearch metallurgy

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	90.17	GPa	—
Shear Modulus(G)	19.48	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.06470	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.07400	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Au4 Pb2

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control