Au4 Pb2
semiconductorAu4Pb2 is an intermetallic compound combining gold and lead in a fixed stoichiometric ratio, belonging to the broader family of precious metal intermetallics. This material is primarily of research and specialized industrial interest rather than a commodity material, with applications in high-reliability electronic contacts, thermal management systems, and specialized soldering applications where the unique combination of gold's nobility and lead's thermal properties offers advantages. Its notable characteristics versus alternatives include enhanced thermal conductivity compared to pure gold and superior corrosion resistance compared to lead-based materials, making it valuable for applications requiring both electrical reliability and thermal performance in demanding environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | — | Pa | — | — | |
Shear Modulus(G) | — | Pa | — | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — | eV | — | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — | eV/atom | — | — |