Au1 Ni4 Sc1

semiconductor

· Au1 Ni4 Sc1

Au₁Ni₄Sc₁ is an intermetallic compound combining gold, nickel, and scandium in a defined stoichiometric ratio. This material belongs to the family of ternary intermetallics and appears to be primarily of research interest rather than established in high-volume industrial production. The scandium addition to gold-nickel systems is explored for potential enhancement of mechanical properties, corrosion resistance, or electronic characteristics, though this specific composition is not commonly encountered in conventional engineering practice.

experimental intermetallic researchhigh-temperature alloy developmentcorrosion-resistant coatingselectronic/photonic devicesaerospace material candidates

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00900	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.4360	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Au1 Ni4 Sc1

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control