Au1 Ni4 Sc1
semiconductor· Au1 Ni4 Sc1
Au₁Ni₄Sc₁ is an intermetallic compound combining gold, nickel, and scandium in a defined stoichiometric ratio. This material belongs to the family of ternary intermetallics and appears to be primarily of research interest rather than established in high-volume industrial production. The scandium addition to gold-nickel systems is explored for potential enhancement of mechanical properties, corrosion resistance, or electronic characteristics, though this specific composition is not commonly encountered in conventional engineering practice.
experimental intermetallic researchhigh-temperature alloy developmentcorrosion-resistant coatingselectronic/photonic devicesaerospace material candidates
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — | eV | — | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — | eV/atom | — | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.