Au1 Cu4 Ho1

semiconductor

· Au1 Cu4 Ho1

Au1Cu4Ho1 is an experimental intermetallic compound combining gold, copper, and holmium in a 1:4:1 atomic ratio. This material belongs to the rare-earth intermetallic family and remains primarily in the research phase, with limited commercial deployment; it is of interest to materials scientists investigating novel high-performance alloys that combine precious metal stability with rare-earth properties for enhanced functional characteristics. Potential applications span niche sectors including advanced electronics, magnetic devices, and high-temperature structural applications where the unique combination of elemental properties—gold's corrosion resistance, copper's conductivity, and holmium's magnetic behavior—may offer advantages over conventional alternatives, though practical engineering adoption would require further development and cost justification.

experimental intermetallicsrare-earth alloysmagnetic device researchadvanced electronicshigh-temperature compoundscorrosion-resistant alloys

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00580	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.3790	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Au1 Cu4 Ho1

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control