AsPAu is an intermetallic compound combining arsenic and gold, belonging to the family of precious metal intermetallics. This material is primarily of research and specialized industrial interest rather than a mainstream engineering choice, with potential applications in high-temperature electronics, wear-resistant coatings, and advanced semiconductor contacts where the combination of gold's chemical stability and arsenic's electronic properties may offer advantages in niche environments.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 1.220 | GPa | DFT · OptB88vdW | ||
Shear Modulus(G) | 1.980 | GPa | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.180 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.4271 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.3589 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data