AsPAu is an intermetallic compound combining arsenic and gold, belonging to the family of precious metal intermetallics. This material is primarily of research and specialized industrial interest rather than a mainstream engineering choice, with potential applications in high-temperature electronics, wear-resistant coatings, and advanced semiconductor contacts where the combination of gold's chemical stability and arsenic's electronic properties may offer advantages in niche environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 1.220 | GPa | — | ||
Shear Modulus(G) | 1.980 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.180 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.4271 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.3589 | eV/atom | — |