AlCuPd2 is an intermetallic compound combining aluminum, copper, and palladium, representing a specialized ternary metal system with potential for high-strength applications at elevated temperatures. This material belongs to the family of lightweight aluminum-based intermetallics and is primarily of research and development interest rather than high-volume production use. Its combination of low density with palladium's corrosion resistance and thermal stability makes it a candidate for aerospace and advanced thermal management applications, though it remains largely experimental and would be selected by engineers exploring next-generation materials for extreme operating conditions or specialized electronic packaging.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.986 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.02270 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf)2 entries | -0.5919 | eV/atom | DFT · OptB88vdW | ||
| ↳ | -0.5721 | eV/atom | Measured |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data