Al2CuPd is an intermetallic compound combining aluminum, copper, and palladium. This material belongs to the family of ternary aluminum intermetallics and is primarily of research and development interest rather than a widely commercialized engineering alloy. It exhibits potential applications in high-temperature structural applications and catalytic systems where the combination of aluminum's lightweight character with copper and palladium's chemical and thermal properties could provide advantages, though industrial adoption remains limited.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2415 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.03550 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.5288 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data