Al1 Ti1 Cu2

semiconductor

· Al1 Ti1 Cu2

Al₁Ti₁Cu₂ is an intermetallic compound combining aluminum, titanium, and copper in a defined stoichiometric ratio, classified as a semiconductor material. This is a research-phase compound rather than a commercial alloy; intermetallics in this composition family are being investigated for potential applications requiring the combined benefits of lightweight metals (Al, Ti) with copper's thermal and electrical properties. The material represents an experimental approach to developing advanced composites for specialized aerospace and electronic applications where conventional alloys cannot meet simultaneous demands for reduced weight, thermal management, and structural performance.

aerospace research and advanced structuresthermal management in electronicshigh-temperature composite developmentlightweight structural applicationsexperimental intermetallic research

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	134.1	GPa	—
Shear Modulus(G)	65.48	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.01570	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.3120	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Al1 Ti1 Cu2

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control