Al₁Mn₁Cu₂ is an intermetallic compound combining aluminum, manganese, and copper in a 1:1:2 ratio, classified here as a semiconductor material. This is a research-phase compound rather than a widely commercialized alloy; intermetallics of this type are typically investigated for their potential to offer improved hardness, wear resistance, and thermal stability compared to conventional aluminum alloys, though at the cost of reduced ductility. Interest in such ternary aluminum-transition metal systems stems from their role as strengthening phases in aerospace and automotive aluminum alloys, where they can improve creep resistance and high-temperature performance.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 125.0 | GPa | — | ||
Shear Modulus(G) | 49.42 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00520 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.08600 | eV/atom | — |