Al1 Cu1 Au2
semiconductorAl₁Cu₁Au₂ is an intermetallic compound combining aluminum, copper, and gold in a fixed stoichiometric ratio, representing a research-phase material in the aluminum-copper-gold ternary system. This composition falls within the broader class of precious-metal-containing intermetallics, which are typically investigated for high-temperature stability, wear resistance, or specialized electronic applications where gold's properties (conductivity, corrosion resistance, biocompatibility) can be leveraged alongside aluminum's light weight and copper's thermal/electrical characteristics. While not a commodity engineering material, intermetallics in this family are explored in aerospace, electronics, and biomedical research contexts where the cost of gold can be justified by performance or reliability demands in extreme or demanding environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — | eV | — | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — | eV/atom | — | — |