AgP is a silver-phosphorus intermetallic compound belonging to the metal alloy class. This material is primarily of research and specialized industrial interest rather than a commodity material, with potential applications in electronic packaging, thermal management, and semiconductor device assembly where silver's electrical and thermal conductivity combined with phosphide chemistry offers advantages. AgP and related silver phosphides are notable for their potential use in advanced solder formulations, contact materials, and high-reliability electronic interconnects where both conductivity and resistance to oxidation are critical.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 10,876.4 | ksi | — | ||
Poisson's Ratio(ν) | 0.4400 | - | — | ||
Shear Modulus(G) | 2,206 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.1959 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.4457 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.4327 | eV/atom | — |