Ag3Sn

metal

· JVASP-18911· Ag3Sn

Ag₃Sn is an intermetallic compound composed of silver and tin, forming a brittle metallic phase that occurs naturally in lead-free solder systems. It is primarily encountered as a constituent phase in Pb-free solder joints and electronic interconnects, where it forms at the interface between molten solder and copper substrates during reflow processes. This material is notable for its role in determining solder joint reliability and thermal fatigue resistance in modern electronics manufacturing, as the growth and morphology of Ag₃Sn crystals directly influence mechanical performance and long-term service life.

lead-free solder jointselectronics interconnectsprinted circuit boardsthermal fatigue resistancemicroelectronics packagingindustrial electronics assembly

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	0.3444	lb/in³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—
Seebeck Coefficient(S)	1.993	µV/K	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.000	eV/atom	—
Formation Energy(ΔHf)	-0.00312	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ag3Sn

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control