Ag3Sn
metal· JVASP-18911· Ag3Sn
Ag₃Sn is an intermetallic compound composed of silver and tin, forming a brittle metallic phase that occurs naturally in lead-free solder systems. It is primarily encountered as a constituent phase in Pb-free solder joints and electronic interconnects, where it forms at the interface between molten solder and copper substrates during reflow processes. This material is notable for its role in determining solder joint reliability and thermal fatigue resistance in modern electronics manufacturing, as the growth and morphology of Ag₃Sn crystals directly influence mechanical performance and long-term service life.
lead-free solder jointselectronics interconnectsprinted circuit boardsthermal fatigue resistancemicroelectronics packagingindustrial electronics assembly
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3444 | lb/in³ | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 1.993 | µV/K | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.00312 | eV/atom | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.