Ag3SI
metalAg₃Si is an intermetallic compound composed of silver and silicon, belonging to the family of metal-silicon compounds that exhibit both metallic and semiconductor-like characteristics. This material is primarily of research and developmental interest rather than established in high-volume industrial production. Ag₃Si is investigated for potential applications in microelectronics, photovoltaics, and advanced interconnect systems where the combination of silver's excellent electrical conductivity and silicon's semiconducting properties could offer advantages; however, it remains largely experimental and competes with more mature alternatives like pure silver contacts, silver-copper alloys, and established solder systems in practical engineering applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 50.38 | GPa | — | ||
Exfoliation Energy(Eexf) | 42.33 | meV/atom | — | ||
Poisson's Ratio(ν) | 0.4000 | - | — | ||
Shear Modulus(G) | 11.05 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 6.807 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.5910 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 15.93 | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij)2 entries | 0.2874 | C/m² | — | ||
| ↳ | 0.2184 | C/m² | — | ||
Piezoelectric Stress Tensor(eij) | Matrix (redacted) | C/m² | — | ||
Seebeck Coefficient(S) | -63.17 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.02750 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.1006 | eV/atom | — |