Zn₃Sn is an intermetallic compound combining zinc and tin, belonging to the family of metallic ceramics or intermetallics rather than traditional ceramics. This material is primarily of research interest for applications requiring lightweight structural components, electronics packaging, and solder alternatives, where its intermediate properties between metals and ceramics offer potential advantages in thermal management and mechanical performance. Industrial adoption remains limited; the material is notable in the context of lead-free soldering research and high-temperature structural applications where tin-zinc systems provide corrosion resistance and improved reliability over conventional alloys.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 6.885 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1278 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.1278 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data