Tm₃Ag₃Sn₃ is an intermetallic compound combining rare-earth thulium with silver and tin in an equiatomic ratio. This material belongs to the family of rare-earth based intermetallics and is primarily a research-phase compound with potential applications in thermoelectric and electronic device materials; it may be investigated for applications requiring specific electronic band structures or thermal transport characteristics that differ from conventional metallic alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.04080 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.5430 | eV/atom | — |