TiSnPd is a titanium-based ternary alloy combining titanium with tin and palladium elements, belonging to the family of advanced titanium systems designed for specialized applications requiring enhanced properties. This composition is primarily of research and developmental interest rather than an established commodity alloy, with potential applications in biomedical implants, aerospace components, and high-reliability electronic interconnects where the palladium addition may improve corrosion resistance and the tin component influences mechanical response. The alloy represents exploration within the Ti-Sn-Pd phase space for niche engineering needs where conventional Ti-6-4 or pure titanium may be insufficient.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 121.6 | GPa | — | ||
Poisson's Ratio(ν) | 0.3300 | - | — | ||
Shear Modulus(G) | 46.80 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 7.603 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.5260 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr)2 entries | 30.81 | - | — | ||
| ↳ | 25.95 range 23.30–28.59median of 2 measurements | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij) | 0.3166 | C/m² | — | ||
Seebeck Coefficient(S) | -309.5 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.5712 | eV/atom | — |