TiCuSn is a titanium-based ternary alloy combining titanium with copper and tin, belonging to the family of titanium alloys developed for specialized engineering applications. This material system is primarily of research and development interest rather than a widely established commercial alloy, with potential applications in aerospace, biomedical, and advanced manufacturing sectors where the combined properties of titanium's strength-to-weight ratio, copper's thermal conductivity, and tin's damping or wear characteristics might be leveraged. The specific composition and processing route would determine whether this alloy targets shape-memory behavior, enhanced damping, improved machinability, or optimized mechanical properties for particular service environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 102.8 | GPa | — | ||
| ↳ | 102.8 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.4761 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν) | 0.2835 | - | — | ||
Shear Modulus(G)2 entries | 52.03 | GPa | — | ||
| ↳ | 52.03 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 7.438 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 11.23 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.02320 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.2060 | eV/atom | — |