Ti2 In1 Ni1

semiconductor

· Ti2 In1 Ni1

Ti₂In₁Ni₁ is an intermetallic compound combining titanium, indium, and nickel in a 2:1:1 stoichiometric ratio. This material is primarily of research and developmental interest rather than established in widespread industrial production; it belongs to the family of titanium-based intermetallics, which are investigated for high-temperature structural applications and electronic device components where tailored mechanical and thermal properties are needed.

intermetallic researchsemiconductor device layershigh-temperature structural testingelectronic material developmentadvanced alloy characterization

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	122.7	GPa	—
Shear Modulus(G)	8.080	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.02020	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.07600	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti2 In1 Ni1

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control