Ti1 Re2 W1
semiconductorTi1Re2W1 is an experimental intermetallic compound combining titanium, rhenium, and tungsten in a 1:2:1 atomic ratio, belonging to the family of refractory metal intermetallics. This material is primarily of research interest for ultra-high-temperature applications where conventional superalloys reach their limits, leveraging the high melting points and oxidation resistance of rhenium and tungsten combined with titanium's structural contributions. The compound remains largely in development stages and is not widely deployed in production; its potential lies in aerospace and energy sectors seeking materials for hypersonic vehicles, advanced rocket engines, and next-generation power generation where operating temperatures exceed 1200 °C.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — | eV | — | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — | eV/atom | — | — |