Ti₁Ni₂Sb₁ is an intermetallic semiconductor compound combining titanium, nickel, and antimony in a fixed stoichiometric ratio. This is a research-phase material belonging to the family of ternary intermetallic semiconductors, which are being investigated for thermoelectric, optoelectronic, and advanced electronic device applications. The material's potential lies in its tunable electronic properties and thermal characteristics that researchers are exploring as alternatives to conventional semiconductors in niche high-temperature or specialized energy conversion contexts.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 153.8 | GPa | — | ||
Shear Modulus(G) | 36.80 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.03450 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3290 | eV/atom | — |