Ti1 Ni1 Sn1

semiconductor

· Ti1 Ni1 Sn1

Ti1Ni1Sn1 is an intermetallic compound combining titanium, nickel, and tin in equiatomic proportions, classified as a semiconductor material. This ternary compound belongs to the family of titanium-nickel-based intermetallics and appears to be primarily a research or experimental material rather than a well-established commercial alloy. The material's potential applications leverage intermetallic properties such as high-temperature stability and unique electronic characteristics, making it relevant for advanced materials research in aerospace, electronics, and thermal management systems where conventional binary alloys reach their limits.

aerospace research materialshigh-temperature compoundsintermetallic semiconductorsthermal barrier coatingselectronics and thermoelectricsmaterials research and development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	91.07	GPa	—
Shear Modulus(G)	-8.660	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.03550	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	0.1270	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti1 Ni1 Sn1

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control