Ti₁Fe₁Sn₁ is an intermetallic compound combining titanium, iron, and tin in equiatomic proportions, classified as a semiconductor material. This ternary system is primarily of research interest rather than established industrial production, representing an emerging materials candidate within the titanium-based intermetallic family where compounds often exhibit high strength-to-weight ratios combined with electronic functionality. The material's potential lies in applications requiring combined mechanical resilience and semiconducting behavior, though it remains in the exploratory phase compared to conventional titanium alloys or established semiconductor materials.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 73.27 | GPa | — | ||
Shear Modulus(G) | -7.280 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.04020 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | 0.3740 | eV/atom | — |