Ti1Cu1Hg2 is an intermetallic compound combining titanium, copper, and mercury in a fixed stoichiometric ratio, classified as a semiconductor material. This compound belongs to the family of ternary intermetallics and represents a research-phase material with limited industrial adoption; its semiconductor characteristics and metallic constituents suggest potential applications in thermoelectric devices, electronic switching, or specialized optoelectronic components, though mercury content raises environmental and handling concerns that have historically limited broader deployment compared to mercury-free alternatives.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 104.8 | GPa | — | ||
Shear Modulus(G) | 21.96 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00250 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | 0.1920 | eV/atom | — |