Ti1Ag1Hg2 is an intermetallic semiconductor compound combining titanium, silver, and mercury in a fixed stoichiometric ratio. This is a research-phase material rather than an established commercial compound; it belongs to the family of ternary intermetallics being investigated for potential optoelectronic and thermoelectric applications where the combination of metallic and semiconductor properties could offer advantages over traditional binary semiconductors.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 87.50 | GPa | — | ||
Shear Modulus(G) | 26.76 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00210 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | 0.1150 | eV/atom | — |