TaN
semiconductor· TaN
Tantalum nitride (TaN) is a ceramic compound semiconductor formed from tantalum and nitrogen, valued for its high hardness, chemical stability, and thermal properties. It is primarily used in thin-film applications including diffusion barriers in microelectronics, hard protective coatings, and wear-resistant surfaces; engineers select it over alternatives like TiN when superior corrosion resistance or specific thermal characteristics are required. The material is also investigated in research contexts for advanced metallization in semiconductor devices and as a component in multiphase coatings for extreme-environment applications.
semiconductor device barriershard protective coatingswear-resistant surfacesdiffusion barriers in microelectronicscorrosion-resistant thin filmshigh-temperature structural coatings
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 337.7 | GPa | — | ||
| ↳ | 335.1 | GPa | — | ||
Poisson's Ratio(ν) | 0.3500 | - | — | ||
Shear Modulus(G)2 entries | 238.1 | GPa | — | ||
| ↳ | 146.8 | GPa | — |
N entriesMultiple entries per property — large groups are collapsed; click a summary row to expand. Use filters above to narrow by form / heat treatment / basis.
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 14.93 | kg/m³ | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 2.300 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 28.05 | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij) | 1.529 | C/m² | — | ||
Seebeck Coefficient(S) | -0.5400 | µV/K | — |
N entriesMultiple entries per property — large groups are collapsed; click a summary row to expand. Use filters above to narrow by form / heat treatment / basis.
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3344 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -1.307 | eV/atom | — | ||
| ↳ | -0.9862 | eV/atom | — |
N entriesMultiple entries per property — large groups are collapsed; click a summary row to expand. Use filters above to narrow by form / heat treatment / basis.
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.