Tantalum nitride (Ta2N) is a refractory ceramic compound combining tantalum metal with nitrogen, belonging to the transition metal nitride family. It is primarily investigated for applications requiring extreme hardness and thermal stability, particularly in thin-film coatings and high-performance cutting tools where conventional materials degrade. Ta2N is of significant research interest for diffusion barriers in microelectronics, wear-resistant coatings on industrial tools, and high-temperature structural applications, though it remains less established in mainstream production compared to more common nitrides like TiN or CrN.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 277.0 | GPa | — | ||
Poisson's Ratio(ν) | 0.3200 | - | — | ||
Shear Modulus(G) | 119.2 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 15.40 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -4.937 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -0.9411 | eV/atom | — | ||
| ↳ | -0.9984 | eV/atom | — |