SnPbAu is a tin-lead-gold ternary alloy belonging to the soft solder family, traditionally used in electronics manufacturing and specialized joining applications. The addition of gold to conventional SnPb solder improves wetting behavior, reduces corrosion susceptibility, and enhances reliability in high-reliability interconnections, making it particularly valuable in aerospace, military, and medical device assembly where solder joint durability under thermal cycling and environmental stress is critical. This alloy represents a bridge between lead-based solders (now restricted under RoHS in consumer electronics) and modern lead-free alternatives, and remains relevant in niche applications where its specific property balance outweighs the cost premium of the gold addition.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 55.73 | GPa | — | ||
Poisson's Ratio(ν) | 0.4000 | - | — | ||
Shear Modulus(G) | -2.240 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.48 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.05142 | eV/atom | — |