SnAu3

metal
· JVASP-37538· SnAu3

SnAu3 is an intermetallic compound composed of tin and gold, representing a stoichiometric phase in the Sn-Au binary system. This material is primarily studied in microelectronics and materials research contexts, where it forms as a reaction product during soldering operations and thermal aging of solder joints. Its brittle intermetallic nature and high density make it notable for understanding reliability and failure mechanisms in electronic assemblies, rather than as a primary engineering material—engineers typically seek to minimize rather than exploit SnAu3 formation in solder-based joints.

electronic solder jointsmicroelectronics reliabilityintermetallic phase analysisthermal cycling studiesmaterials research

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
PropertyValueUnitConditionsSource
Density(ρ)
14.90
kg/m³
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
0.000
eV
Magnetic Moment(μB)
0.000
µB
Seebeck Coefficient(S)
7.440
µV/K
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Energy Above Hull(ΔEhull)
0.04660
eV/atom
Formation Energy(ΔHf)
-0.04034
eV/atom
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.