Sn7Bi is a tin-bismuth lead-free solder alloy, classified as an intermetallic ceramic compound designed for electronic joining applications. It is widely used in electronics manufacturing, particularly in consumer devices, automotive electronics, and medical equipment where lead-free soldering is mandated by environmental regulations (RoHS). This alloy is valued for its relatively low melting point and good wetting behavior compared to some alternatives, making it an important option for applications requiring reliable solder joints in temperature-sensitive or miniaturized assemblies.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.635 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.05710 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.05714 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data