Sn11Au89
metal· Sn11Au89
Sn11Au89 is a tin-gold intermetallic compound containing approximately 11% tin and 89% gold by composition. This material belongs to the Au-Sn system, which is well-established in microelectronics and bonding applications where controlled intermetallic phases are deliberately engineered for reliability. The alloy is primarily used in flip-chip and die-attach bonding in semiconductor packaging, where its specific melting behavior and interfacial characteristics provide advantages over pure gold or other solder systems in high-reliability applications such as aerospace and military electronics.
semiconductor die attachflip-chip bondinghigh-reliability electronicsaerospace packaginggold-based interconnectsintermetallic phase engineering
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — | eV/atom | — | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.