Sn11Au89

metal

· Sn11Au89

Sn11Au89 is a tin-gold intermetallic compound containing approximately 11% tin and 89% gold by composition. This material belongs to the Au-Sn system, which is well-established in microelectronics and bonding applications where controlled intermetallic phases are deliberately engineered for reliability. The alloy is primarily used in flip-chip and die-attach bonding in semiconductor packaging, where its specific melting behavior and interfacial characteristics provide advantages over pure gold or other solder systems in high-reliability applications such as aerospace and military electronics.

semiconductor die attachflip-chip bondinghigh-reliability electronicsaerospace packaginggold-based interconnectsintermetallic phase engineering

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.01350	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Sn11Au89

Other Properties

Regulatory Screening

Environmental

Export Control