Sn1Ho1Au1 is an intermetallic compound combining tin, holmium, and gold in equiatomic proportions, classified as a semiconductor material. This is a research-phase compound rather than a commercialized engineering material; it belongs to the family of rare-earth intermetallics that are of interest for studying magnetic, electronic, and thermal properties at the intersection of noble metals and lanthanide elements. The material's potential relevance lies in fundamental semiconductor physics and specialized applications where the combination of tin's semiconducting behavior, holmium's magnetic properties, and gold's stability could enable novel functionality in niche research contexts.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 85.87 | GPa | — | ||
Shear Modulus(G) | 40.36 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.1411 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.8710 | eV/atom | — |