Tin (Sn) is a soft, malleable metal with a silvery appearance, known for its corrosion resistance and low toxicity compared to other metallic alternatives. It is primarily used in solder formulations for electronics assembly, coating applications to prevent corrosion (tin plating), and as a alloying element in bronzes and other specialty alloys. Engineers select tin for applications requiring reliable joint formation in PCBs, protection of steel and copper substrates, and situations where lead-free compositions are mandated by regulation or design requirement.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 38.49 | GPa | — | ||
| ↳ | 22.83 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.3356 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Exfoliation Energy(Eexf) | 96.40 | meV/atom | — | ||
Poisson's Ratio(ν)2 entries | 0.2658 | - | — | ||
| ↳ | 0.4800 | - | — | ||
Shear Modulus(G)2 entries | 21.36 | GPa | — | ||
| ↳ | 7.440 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 2.342 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 113.4 | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij) | 0.000 | C/m² | — | ||
Seebeck Coefficient(S) | 4.753 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.8824 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.8659 | eV/atom | — |