SiCu2S3 is a ternary intermetallic compound combining silicon, copper, and sulfur elements, belonging to the metal sulfide family. This material is primarily investigated in research contexts for thermoelectric and semiconductor applications, where the combination of metallic and chalcogenide properties offers potential for energy conversion and electronic devices. Its use remains largely experimental, with interest driven by its electronic structure and potential as an alternative to conventional thermoelectric materials in applications requiring cost-effective or earth-abundant compositions.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 3.878 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 1.331 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 12.03 | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij)2 entries | 0.1430 | C/m² | — | ||
| ↳ | 0.7182 | C/m² | — | ||
Piezoelectric Stress Tensor(eij) | Matrix (redacted) | C/m² | — | ||
Seebeck Coefficient(S) | -252.9 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.00540 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.4999 | eV/atom | — |