Si3Ag is a silver-containing intermetallic compound that belongs to the metal/alloy family, combining silicon with silver in a defined stoichiometric ratio. This material is primarily of research and specialized industrial interest, typically encountered in electronic packaging, brazing applications, and thermal management systems where silver's excellent electrical and thermal conductivity is leveraged in combination with silicon's structural properties. Si3Ag and related silver-silicon compounds are notable for their potential in high-reliability solder alternatives, microelectronics bonding, and advanced composite matrices, offering engineers a pathway to improve joint strength and thermal transport in systems requiring both mechanical integrity and electrical performance.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 75.96 | GPa | — | ||
Poisson's Ratio(ν) | 0.4800 | - | — | ||
Shear Modulus(G) | 3.550 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.735 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 3.923 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.6407 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.6372 | eV/atom | — |