Si₁Tc₂W₁ is an intermetallic compound combining silicon, technetium, and tungsten in a semiconductor material system. This is a research-phase compound not yet established in mainstream commercial applications; it belongs to the family of refractory intermetallics that may offer potential for high-temperature semiconductor or structural applications where combined hardness and electronic properties are desired. Engineers would evaluate this material primarily in academic or advanced materials development contexts rather than production environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 279.9 | GPa | — | ||
Shear Modulus(G) | 98.14 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00450 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3300 | eV/atom | — |