Re1Sn3 is an intermetallic compound combining rhenium and tin in a 1:3 stoichiometric ratio, classified as a semiconductor material. This compound belongs to the family of transition metal-tin intermetallics, which are primarily investigated in research contexts for their unique electronic and structural properties. Re1Sn3 is notable for its potential in thermoelectric applications and advanced electronic devices where the interplay between metallic bonding and semiconducting behavior offers advantages over conventional materials.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 90.13 | GPa | — | ||
Shear Modulus(G) | 13.22 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01100 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | 0.7660 | eV/atom | — |